TU1.R11.1: MULTISENSOR VALIDATION OF SNOW ALBEDO AND GRAIN SIZE RETRIEVAL IN MOUNTAIN AREAS
Claudia Notarnicola, Benedita Milheiro Santos, Riccardo Barella, Michele Claus, Eurac Research, Italy; Edoardo Cremonese, CIMA Research Foundation, Italy; Ludovica De Gregorio, Eurac Research, Italy; Biagio Di Mauro, CNR- Institute of Polar Science, Italy; Gabriele Schwaizer, Thomas Nagler, ENVEO IT GmbH, Austria
TU1.R11.2: MONITORING PHYSICAL SNOW PROPERTIES IN ALPINE REGIONS USING MULTISENSOR DATA
Thomas Nagler, Gabriele Schwaizer, Lucia Felbauer, Nico Mölg, Lars Keuris, Markus Hetzenecker, Johanna Nemec, Helmut Rott, ENVEO Environmental Earth Observation Information Technology GmbH, Austria; Espen Volden, European Space Agency, Italy
TU1.R11.3: RETRIEVAL OF SNOW PROPERTIES FROM HYPERSPECTRAL DATA
Roberto Colombo, Università Milano Bicocca, Italy; Biagio Di Mauro, 2National Research Council,, Italy; Claudia Ravasio, Roberto Garzonio, Università Milano Bicocca, Italy
TU1.R11.4: INTEGRATION OF ACTIVE AND PASSIVE MULTIFREQUENCY DATA FROM AMSR-2 AND COSMO SKYMED FOR SNOW DEPTH MONITORING AT HIGH RESOLUTION IN ALPINE ENVIRONMENTS
Emanuele Santi, Simone Pettinato, Simonetta Paloscia, Simone Pilia, Fabrizio Baroni, Giuliano Ramat, National Research Council - Institute of Applied Physics (CNR - IFAC), Italy
TU1.R11.5: COMBINING TERRESTRIAL PHOTOGRAPHY AND SENTINEL-1 IMAGERY FOR ASSESSING WET SNOW DYNAMICS IN EPHEMERAL SNOWPACK OVER SEMIARID MOUNTAIN AREAS
Rafael Pimentel, Pedro Torralbo, María José Polo, Univeristy of Cordoba, Spain; Claudia Notarnicola, EURAC, Italy
TU1.R11.6: TANDEM-X BISTATIC INSAR FOR MEASURING SNOW AND ICE MELT DYNAMICS
Paola Rizzoli, Carolina Gonzalez, Alexandre Becker Campos, Luca Dell'Amore, German Aerospace Center, Germany; Pietro Milillo, University of Houston, United States; Thomas Nagler, ENVEO GmbH, Austria
TU1.R11.7: SNOW PACK STRUCTURE CHARACTERIZATION USING SPACE BORNE SAR TOMOGRAPHY: CONCEPT AND PERFORMANCE STUDY
Laurent Ferro-Famil, ISAE-SUPAERO & CESBIO, University of Toulouse, France; Stefano Tebaldini, DEIB, Politecnico di Milano, Italy; Francesco Banda, Aresys, Italy
